My main focus

Engineering experience and technical record

My work spans concept development, electromechanical design, production, quality, product validation, and failure analysis. This page also lists previous companies, technical subjects, talks, and publications.

Career

Before starting E-Consult International in 2010, I had 29 years of experience from full-time employment in eight different companies. Over the years I have built up extensive practical experience with realisation of electronics hardware from concepting, design, Thickfim and PCB-layout, technology reviews, prototyping, over product validation to mass production. The experience have been obtained via many different engineering job roles such as, Development-, Research-, Production-, Quality-, Failure Analysis-, and Technology-Engineer, as well as project-, group-, department- and business-manager. During my 10 years at Nokia Mobile Phones, I worked as Technical Expert, Internal Connectivity, Reliability, Component Packaging, PCB/Flex Technologies and Hardware concepting. This combined with my experience from technical and managerial positions within segments as Industrial-, Consumer-, Medico-, Telecom-, Space- and Avionics-Electronics, has given me a solid base to give professional consultancy support to companies who wish to be best-in-class in designing and manufacturing electronics devices. A background that has given me a holistic approach to how quality products are made, but also a background that has taught me to collaborate with and understand all categories of employees (from the warehouse assistant to the Director level) who contributes to the product creation process and volume production.

Over the years I have participated in the design and manufacturing of more than 230 electronics modules, components and devices and thereby gained a holistic approach to all electronics/device processes from cradle to grave, with a strong focus on "customer satisfaction", reliability and "total earnings", which I find more important than an often misunderstood short-term pursuit of the lowest possible BOM cost, which in the worst case can result in production/yield problems, large quality and service costs and potentially "lost sales".

Since 2010, I have run E-Consult International, providing independent professional technical sparring to several companies in Denmark, Europe, China and the United States. Throughout my career, I have always asked critical questions about "current state design methods" and actively been a "technology scout" who annually attend international conferences, seminars or trade fairs, to be able to follow technology and manufacturing state-of-the-art trends. Therefore, I'm able to critically challenge technology roadmaps and to facilitate and execute implementation of new, or forgotten, technologies if and when it makes sense.

Client and company experience

Selected client and company logos from Claus’s engineering and management career.

  • Alcatel Space logo
  • Ambu logo
  • Audientes logo
  • BK Medical logo
  • Bragi logo
  • Cobham logo
  • Coloplast logo
  • Comatch logo
  • Cryptera logo
  • Cryosberg logo
  • Dainamant logo
  • Danfoss logo
  • DIS CREADIS logo
  • a-s elbau logo
  • Ferroperm Components ApS logo
  • Fraunhofer IZM logo
  • GN ReSound logo
  • Grundfos logo
  • Hammer Electronic logo
  • HOUNÖ logo
  • Huawei logo
  • HZO logo
  • Kaleido Technology logo
  • Laser Tech Services a-s logo
  • Loctam logo
  • Martin by HARMAN logo
  • MEC Switches logo
  • MeQu logo
  • Medicom logo
  • MJK Automation logo
  • NeoCortec logo
  • NKT Photonics logo
  • Nokia logo
  • Nordic Power Converters logo
  • Novo Nordisk logo
  • Oticon logo
  • Pape Hybrico logo
  • Printline logo
  • Proudfoot logo
  • Uneeg Medical logo
  • Universal Robots logo
  • Varova Investments logo
  • Weibel Doppler Radars logo
  • Wiseled logo
  • Xylon logo

Environments

My main focus is on optimisation of the physical hardware design and material/technology-selection with respect to DFX, Manufacturability, Manufacturing yield, Total lifetime cost (not just BOM-cost) and Reliability/Robustness in the field.

  • Mobile phonesHigh-volume, automated production
  • Space electronicsLower-volume, high-reliability products
  • Hearing aidsCompact electronic assemblies
  • Harsh conditionsVibration, shock, condensation, liquid ingress, and corrosion

Technical scope

  • Physical hardwareConcept selection, electromechanical design, miniaturisation, modularisation, materials, component packaging, interconnections, substrates, and PCB/PWB surface finishes.
  • Production and DfXManufacturing and assembly, process flow, test, quality, reliability, manufacturing yield, supply-chain constraints, and total lifetime cost.
  • Reliability and failure analysisVibration, shock, condensation, liquid ingress, and corrosion; coating and underfill; interconnect reliability; validation; and failure analysis.

Credentials

  • B.Sc. Electrical Engineering, ElectromechanicsDanmarks Ingeniør Akademi, 1980
  • Six Sigma Green BeltCertification obtained in 2003
  • OEM LEAN101Certification obtained in 2012

Technical record

Talks, seminars, articles, and publications.

My technical record covers electronic substrates and manufacturing technologies; component packaging and interconnections; PCB surface finishes; coating and underfill; corrosion; failure analysis; and hardware reliability. This work has been presented at technology seminars and international microelectronics conferences (IMAPS, ICEP, SMTA, ...) in USA, Japan, China, Germany, The Netherlands, Finland, Norway, Sweden and Denmark, and published in technical magazines and reports.

Claus Würtz Nielsen presenting a lecture on product development and DfX
  • ICEP — International Conference on Electronics Packaging
  • IMAPS — International Microelectronics Assembly and Packaging Society
  • SMTA — Surface Mount Technology Association

Talks

2024: SMTA, Electronics in Harsh Environments conference at DTU, Denmark

Keynote presentation: Design for high reliability in harsh environments.

2022: DfX seminar · Odense, Denmark

DfX: What, Why and How

Held in cooperation with FORCE, GPV, and ICAPE.

2017: Asymtek Technology Days · Geldrop, the Netherlands

Coating Considerations

2015 · Asymtek Technology Days · Maastricht, the Netherlands

Why and When Is Coat and Underfill Needed?

2015: HIN Seminar, Horsens, Denmark

Why and when is Coating and Cleaning needed?

2014: PCB Reliability Seminar · Copenhagen, Denmark

How to Improve PCB/PCBA Design, Performance and Reliability

2013: SPM DFMA meeting hosted by B&O · Struer, Denmark

From DIL Packages to Embedded Components

The evolution of component packaging, interconnection, and substrate technologies.

2012: IPU Corrosion in Electronics Seminar · Lyngby, Denmark

Organisation Structure Impact on Reliability Problem Solving

2011: Asymtek Technology Days · Heerlen, the Netherlands

Micro Coating and Underfill: A Must to Obtain High Reliability of Mobile Devices

2006: ICEP Conference · Tokyo, Japan

Paradigm Shift for PWB Surface Finishes in Mobile Phone Terminals

2006: Pan Pacific Electronic Symposium, Hawaii

New trends for PWB surface finishes in mobile phone applications

2004: IMAPS Nordic Conference, Helsingør Denmark

The evolution of surface finishes in mobile phone applications

2003: DAMAG Temadag for printdesignere, Odense Denmark

Kultryk på print

2011: Printline Seminar at the Danish Embassy in Oslo, Norway and in Odense Denmark at Printline

1) From DIL Packages to Embedded Components. 2) Interconnect Reliability Problems and Solutions

Publications

October 2014: Elektronik & Data

Coating beskytter elektronikken

Published in the October 2014 edition of the Danish electronics magazine.

August 2014: Elektronik & Data

Dybt i Nokias maskinrum

Published in the August 2014 edition of the Danish electronics magazine.

June 1993: Elektronik & Data

Laser Trimming Thickfilm Hybrids

October 1993: Elektronik & Data

Chip & Wire Techniques

1991: Circuit World, Vol. 17, No. 3

Design Guidelines for Polymer Thickfilm Technology

Published in the international magazine Circuit World.

1990: Nordic cooperation project

Polymer Thickfilm Technology: Design Guidelines and Applications

Co-authored output of a Nordic cooperation project from 1988 to 1990, supported by Nordisk Industrifond. ISBN 82-992193-0-2.

1987: Elektronik Centralen EC-report ECR-202

Polymer Circuit and Component Board (PC2B)

Additional talks and seminars

Show 6 additional entries
  • 1990: Instituttet for Verkstadsteknisk Forskning, Sweden, and Elektronik Centralen, Denmark: Polymer Thick Film Connection Techniques
  • 1990: ISHM Nordic Conference · Åland, Finland: PTF: An Attractive Supplement to Traditional Thickfilm and PCB Technology
  • 1986: ISHM Nordic Conference · Helsinki, Finland: Results from the PTF Research Project “PC2B” at a-s Elbau
  • 1986: Elbau and Radiometer theme day · Hotel Eremitage, Denmark: Undersøgelse af Polymer TykFilm teknologiens muligheder og begrænsninger
  • 1986: EKF seminar · Hotel Holmenkollen, Norway: Results from the Joint Nordic Project PC2B
  • 1985: Elektronik Seminar 85 · Bellacentret, Denmark: Polymer Circuit and Component Board (PC2B)

Technical review

Discuss a design, failure mode, or production decision.

Contact Claus